<span>Background of the invention: The present invention relates to the capacitor arts. It finds particular application in conjunction with titanium, aluminum, tantalum and other metal sponges for capacitor anodes grown in the form of dendrites on metallic substrates, and will be described with particular reference thereto. The invention is also applicable to the growth of sponges for a variety of applications in which a high accessible surface area to volume ratio is desired. Electrical devices, such as power supplies, switching regulators, motor control-regulators, computer electronics, audio amplifiers, surge protectors, and resistance spot welders often require substantial bursts of energy in their operation. Capacitors are energy storage devices that are commonly used to supply these energy bursts by storing energy in a circuit and delivering the energy upon timed demand. Typically, capacitors consist of two electrically conducting plates, referred to as the anode and the cathode, which are separated by a dielectric film. In order to obtain a high capacitance, a large dielectric surface area is used, across which the electrical charge is stored. The capacitance, C of a capacitor is determined by the formula: ##EQU1##where Q is the electrical charge and V is the voltage between the plates. Capacitance is proportional to the charge-carrying area of the facing plates, A, and is inversely proportional to the gap width, X, so </span><span>that ##EQU2##where (.epsilon..multidot..epsilon..sub.0) is a proportionality constant, .epsilon..sub.0 is the permittivity of vacuum (value=8.85.times.10.sup.-12 Farad/m), and .epsilon. is the relative permittivity or dielectric constant for a dielectric substance. High capacitance capacitors should have a large area, A, and a thin dielectric film with a high dielectric constant. Commercial capacitors attain large surface areas by one of two methods. The first method uses a large area of thin foil as the anode and cathode. See, e.g., U.S. Pat. No. 3,410,766. The foil is either rolled or stacked in layers. In the second method, a fine powder is sintered to form a single slug with many open pores, giving the structure a large surface area. See, e.g., U.S. Pat. No. 4,041,359. Both these methods require considerable processing to obtain the desired large surface area. In addition, the sintering method results in many of the pores being fully enclosed and thus inaccessible to the dielectric.Metallic sponges provide an opportunity for increasing the surface area over conventional capacitor materials. Metallic sponges of titanium, such as those produced by the Hunter and Kroll processes, have relatively large surface areas. However, due to the random growth patterns, surface areas are not maximized and a considerable portion of the surface is inaccessible, being fully enclosed by the sponge.http://www.google.com/patents?vid=USPAT6495021</span>

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